Prototyping Boards

Adapter Boards

28 Lead SOIC to DIP Adapter – #PC8028S127

FEATURES

  • Allows easy mounting of a 28 lead standard SOIC package to a through hole, .100" grid development board.
  • Extended copper ground plane beyond the required bottom ground pad.
  • Bypass cap pads from ground / power pins to DIP pins speeding assembly time.
  • Through hole pins mounted on a rugged FR4 substrate.
  • SOIC mounting surface is lead free solder for longest shelf life and easy soldering.
  • 2 hand stencils provided with each adapter order.
  • Stencil mounts on top of the through hole pins providing proper paste registration.

DESCRIPTION

Adapter allows convenient mounting of your SOIC to a general purpose, .100″ grid breadboard.  This is a 28 lead SOIC adapter designed to accommodate a Standard package width. Two (2) additional pads available for bypass capacitors making the assembly to your breadboard faster.  We also have provided an extended copper plane beyond the necessary bottom ground pad to assist with heat removal. Center ground pad is stitched with thermal vias to help pull the heat away.

Other lead counts available from 8 to 18 in both Narrow and Standard package widths.

For easy solder pasting, all adapters are shipped with a hand stencil.  Proper registration of the stencil to pads is achieved by mounting the stencil on top of the DIP pins.  We recommend using #4 solder paste which has smaller particle size and will yield more consistent results. Complete soldering recommendations are provided in each shipment.

Works with Precision PCBS series PC40, PC45, PCPG47 General Purpose breadboards, all available on Digikey.

BOARD FABRICATION DETAILS

  • Matches Standard SOIC width of .300" (7.62mm)
  • Matches pin to pin pitch of .050" (1.27mm )
  • FR4 TG-170 substrate
  • Substrate dimensions 1.60" x .80" x .062"
  • Solder surface is LF HASL ( lead free solder )
  • 30 through hole pins .030", Tin/Nickel plating

BGA Soldering Recommendations

  1. Use #4 solder paste for best results.
  2. Place board in your development board for stability during pasting. Alternatively, place the
    adapter in a foam base ( provided ) for stability during pasting.
  3. Place the stencil over the pins. Confirm it is flat on the board ( no arching ).
  4. Confirm the pads are visible and aligned correctly (easiest through a microscope).
  5. Use the second stencil as a squeegee.
  6. After pasting, remove the board from the dev board and hold by the pins with one hand. With
    the other hand pull the stencil straight up off the pins. Pulling at an angle may pull solder paste
    off some or all of the pads.
  7. Correctly place the SMD part onto the pasted board.
  8. Using a hot air gun, apply heat carefully to the top of the part.
    Temperature set point 360 C – 400 C (use lower temperature to start).
    Air flow should be low enough so that the part is not jostled or blown off the board.
    Reflow should occur in 10 to 15 seconds possibly less.
  9. Probe the through hole pins to confirm that all of the BGA balls have collapsed and are
    electrically connected to the board.

REV 1.0