Prototyping Boards

Adapter Boards

6 Lead SOT-363 Adapter to DIP / #PC90363-6


  • Allows easy mounting of SOT-363-6 package to through hole, .100" grid development boards.
  • Extended copper plane beyond required bottom ground pad helps remove heat.
  • Bypass cap pads from ground / power pins to DIP pins to speed assembly.
  • Through hole pins mounted on rugged FR4 substrate.
  • Mounting surface is lead free solder for longest shelf life and easy soldering.
  • Hand stencil provided with each adapter.
  • Stencil mounts on top of the through pins providing proper paste registration.
  • Patent Pending


Adapter allows convenient mounting of your SOT to a general purpose, .100″ grid breadboard.  This is a 6 lead SOT363-6 adapter. In addition, Two (2)  pads are provided for bypass capacitors making assembly to your breadboard faster.

Other lead counts and SOT package designs are available.

For easy solder pasting, all adapter orders are shipped with a hand stencil.  Proper registration of the stencil to pads is achieved by mounting the stencil on top of the DIP pins.  We recommend using #4 solder paste which has smaller particle size and will yield more consistent results. Complete soldering recommendations are provided in each shipment.

Works with Precision PCBS series PC40, PC45, PCPG47 General Purpose breadboards, all available on Digikey.


  • Matches SOT326-6 pin out
  • FR4 TG-170 substrate
  • Substrate dimensions .400" x .500" x .062"
  • Solder surface is LF HASL ( lead free solder )
  • 8 Through hole pins .030", Tin/Lead plating

BGA Soldering Recommendations

  1. Use #4 solder paste for best results.
  2. Place board in your development board for stability during pasting. Alternatively, place the
    adapter in a foam base ( provided ) for stability during pasting.
  3. Place the stencil over the pins. Confirm it is flat on the board ( no arching ).
  4. Confirm the pads are visible and aligned correctly (easiest through a microscope).
  5. Use the second stencil as a squeegee.
  6. After pasting, remove the board from the dev board and hold by the pins with one hand. With
    the other hand pull the stencil straight up off the pins. Pulling at an angle may pull solder paste
    off some or all of the pads.
  7. Correctly place the SMD part onto the pasted board.
  8. Using a hot air gun, apply heat carefully to the top of the part.
    Temperature set point 360 C – 400 C (use lower temperature to start).
    Air flow should be low enough so that the part is not jostled or blown off the board.
    Reflow should occur in 10 to 15 seconds possibly less.
  9. Probe the through hole pins to confirm that all of the BGA balls have collapsed and are
    electrically connected to the board.

REV 1.0