Prototyping Boards

Adapter Boards

25 Ball BGA Adapter – #P6025B40


  • 25 ball BGA to DIP adapter on .100" grid
  • .4mm ball pitch
  • Allows easy mounting your BGA to your development board
  • Ships with hand solder paste stencil.
  • Mount the stencil on top of the board pins for proper paste registration.
  • Inquire directly about shipping with BGA mounted
  • Patent Pending


Adapter allows convenient mounting of your BGA packages to a general purpose, .100″ grid breadboard.  Offered in multiple ball counts from 4 to 25 and designed around the TI WLCSP (DSBGA ) BGA pin outs.  For easy solder pasting, all adapters are shipped with a hand stencil.  Proper registration of the stencil is achieved by mounting on the tops of the DIP pins.

Works with Precision PCBS series PC40, PC45, PCPG47 breadboards, all available on Digikey.


  • FR4 Substrate
  • ENIG final finish
  • Substrate dimensions 1.300" x .400" x .062"
  • 25 mounting pins, .030" square, Tin/Nickel plating

BGA Soldering Recommendations

  1. Use #4 solder paste for best results.
  2. Place board in your development board for stability during pasting. Alternatively, place the
    adapter in a foam base ( provided ) for stability during pasting.
  3. Place the stencil over the pins. Confirm it is flat on the board ( no arching ).
  4. Confirm the pads are visible and aligned correctly (easiest through a microscope).
  5. Use the second stencil as a squeegee.
  6. After pasting, remove the board from the dev board and hold by the pins with one hand. With
    the other hand pull the stencil straight up off the pins. Pulling at an angle may pull solder paste
    off some or all of the pads.
  7. Correctly place the SMD part onto the pasted board.
  8. Using a hot air gun, apply heat carefully to the top of the part.
    Temperature set point 360 C – 400 C (use lower temperature to start).
    Air flow should be low enough so that the part is not jostled or blown off the board.
    Reflow should occur in 10 to 15 seconds possibly less.
  9. Probe the through hole pins to confirm that all of the BGA balls have collapsed and are
    electrically connected to the board.

REV 1.0