Standard Product Series

Adapter Boards

4 Ball BGA to DIP Adapter – PC604BR35

FEATURES

  • Compact 4 ball BGA to .100" grid DIP
  • .35mm ball pitch
  • Allows easy mounting of BGA to your bench development board
  • 3.0cm x 3.0cm Solder paste stencil provided for hand stenciling.
  • Inquire directly for pre-mounted BGA

DESCRIPTION

Adapter allows convenient mounting of your BGA packages to a general purpose, .100″ grid breadboard.  Offered in multiple ball counts from 4 to 25 and designed around the TI WLCSP (DSBGA ) BGA pin outs.  For easy solder pasting, all adapters are shipped with a hand stencil, 3cm x 3cm.  Proper registration of the stencil is achieved by mounting on the tops of the DIP pins.  Use a brush or small flat applicator as a squeegee.

Works with Precision PCBS series PC40, PC45, PCPG47 breadboards, all available on Digikey.

BOARD FABRICATION DETAILS

  • FR4 substrate
  • PCB dimensions .400" x ,500" x .062"
  • ENIG final BGA finish
  • 4 mounting pins, .03" square ; Tin over Nickel
  • Solder paste stencil dimensions 3.0cm x 3.0cm x .10mm